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Haven't done one in a while but was wondering about the equipotential grid . A few years ago I would just hit all the steel supports with a lug and #8 solid , hit the motor and water bond . But the pool guys electrician said he has to dig 3 feet around the whole pool and go 18 inches down for ground grid. The home owner called me to to give her a quote since I do all her work . So it got me wondering if something has changed that I haven't heard of yet ? I'm in mass if that helps
 

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I don't see anything about digging a 3' trench.



680.26 Equipotential Bonding.
(A) Performance. The equipotential bonding required by this section shall be installed to reduce voltage gradients in the pool area.

(B) Bonded Parts. The parts specified in 680.26(B)(1) through (B)(7) shall be bonded together using solid copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or other identified corrosion-resistant metal. Connections to bonded parts shall be made in accordance with 250.8. An 8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be required to be extended or attached to remote panelboards, service equipment, or electrodes.
(1) Conductive Pool Shells. Bonding to conductive pool shells shall be provided as specified in 680.26(B)(1)(a) or (B)(1)(b). Poured concrete, pneumatically applied or sprayed concrete, and concrete block with painted or plastered coatings shall all be considered conductive materials due to water permeability and porosity. Vinyl liners and fiberglass composite shells shall be considered to be nonconductive materials.
(a) 
Structural Reinforcing Steel. Unencapsulated structural reinforcing steel shall be bonded together by steel tie wires or the equivalent. Where structural reinforcing steel is encapsulated in a nonconductive compound, a copper conductor grid shall be installed in accordance with 680.26(B)(1)(b).
(b) 
Copper Conductor Grid. A copper conductor grid shall be provided and shall comply with (b)(1) through (b)(4).
(1) 
Be constructed of minimum 8 AWG bare solid copper conductors bonded to each other at all points of crossing. The bonding shall be in accordance with 250.8 or other approved means.
(2) 
Conform to the contour of the pool
(3) 
Be arranged in a 300-mm (12-in.) by 300-mm (12-in.) network of conductors in a uniformly spaced perpendicular grid pattern with a tolerance of 100 mm (4 in.)
(4) 
Be secured within or under the pool no more than 150 mm (6 in.) from the outer contour of the pool shell
(2) Perimeter Surfaces. The perimeter surface shall extend for 1 m (3 ft) horizontally beyond the inside walls of the pool and shall include unpaved surfaces, as well as poured concrete surfaces and other types of paving. Perimeter surfaces less than 1 m (3 ft) separated by a permanent wall or building 1.5 m (5 ft) in height or more shall require equipotential bonding on the pool side of the permanent wall or building. Bonding to perimeter surfaces shall be provided as specified in 680.26(B)(2)(a) or (2)(b) and shall be attached to the pool reinforcing steel or copper conductor grid at a minimum of four (4) points uniformly spaced around the perimeter of the pool. For nonconductive pool shells, bonding at four points shall not be required.
(a) 
Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with 680.26(B)(1)(a).
(b) 
Alternate Means. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, a copper conductor(s) shall be utilized where the following requirements are met:
(1) 
At least one minimum 8 AWG bare solid copper conductor shall be provided.
(2) 
The conductors shall follow the contour of the perimeter surface.
(3) 
Only listed splices shall be permitted.
(4) 
The required conductor shall be 450 mm to 600 mm (18 in. to 24 in.) from the inside walls of the pool.
(5) 
The required conductor shall be secured within or under the perimeter surface 100 mm to 150 mm (4 in. to 6 in.) below the subgrade.
(3) Metallic Components. All metallic parts of the pool structure, including reinforcing metal not addressed in 680.26(B)(1)(a), shall be bonded. Where reinforcing steel is encapsulated with a nonconductive compound, the reinforcing steel shall not be required to be bonded.
(4) Underwater Lighting. All metal forming shells and mounting brackets of no-niche luminaires shall be bonded.
Exception:  Listed low-voltage lighting systems with nonmetallic forming shells shall not require bonding.
(5) Metal Fittings. All metal fittings within or attached to the pool structure shall be bonded. Isolated parts that are not over 100 mm (4 in.) in any dimension and do not penetrate into the pool structure more than 25 mm (1 in.) shall not require bonding.
(6) Electrical Equipment. Metal parts of electrical equipment associated with the pool water circulating system, including pump motors and metal parts of equipment associated with pool covers, including electric motors, shall be bonded.
Exception:  Metal parts of listed equipment incorporating an approved system of double insulation shall not be bonded.
(a) 
Double-Insulated Water Pump Motors. Where a double-insulated water pump motor is installed under the provisions of this rule, a solid 8 AWG copper conductor of sufficient length to make a bonding connection to a replacement motor shall be extended from the bonding grid to an accessible point in the vicinity of the pool pump motor. Where there is no connection between the swimming pool bonding grid and the equipment grounding system for the premises, this bonding conductor shall be connected to the equipment grounding conductor of the motor circuit.
(b) 
Pool Water Heaters. For pool water heaters rated at more than 50 amperes and having specific instructions regarding bonding and grounding, only those parts designated to be bonded shall be bonded and only those parts designated to be grounded shall be grounded.
(7) Fixed Metal Parts. All fixed metal parts shall be bonded including, but not limited to, metal-sheathed cables and raceways, metal piping, metal awnings, metal fences, and metal door and window frames.
Exception No. 1:  Those separated from the pool by a permanent barrier that prevents contact by a person shall not be required to be bonded.
Exception No. 2:  Those greater than 1.5 m (5 ft) horizontally from the inside walls of the pool shall not be required to be bonded.
Exception No. 3:  Those greater than 3.7 m (12 ft) measured vertically above the maximum water level of the pool, or as measured vertically above any observation stands, towers, or platforms, or any diving structures, shall not be required to be bonded.
(C) Pool Water. Where none of the bonded parts is in direct connection with the pool water, the pool water shall be in direct contact with an approved corrosion-resistant conductive surface that exposes not less than 5800 mm2 (9 in.2) of surface area to the pool water at all times. The conductive surface shall be located where it is not exposed to physical damage or dislodgement during usual pool activities, and it shall be bonded in accordance with 680.26(B).
 

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I just did a pool and had a question regarding the water bond. The only piece I could find that was in full contact with water was the pump. For whatever reason I thought that it was in my best interest to keep the equipotential grid separate from my bond at the sub panel.

Does this matter?

Essentially the bond wire, from my panel to my equipment, would continue all the way out to the pool deck and frame.

Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app
 

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running dummy said:
I just did a pool and had a question regarding the water bond. The only piece I could find that was in full contact with water was the pump. For whatever reason I thought that it was in my best interest to keep the equipotential grid separate from my bond at the sub panel. Does this matter? Essentially the bond wire, from my panel to my equipment, would continue all the way out to the pool deck and frame. Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app

Huh?

I just ring the pool, hit four spots, put the plate in the skimmer and end it at the pump.

You don't go back to the panel with it
 

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Huh?

I just ring the pool, hit four spots, put the plate in the skimmer and end it at the pump.

You don't go back to the panel with it
That's what I'm asking. I didn't see anything provided to bond the water. Do you have a product number or an image for the plate?

If you read my post all I'm asking is if it's wrong to bond the pump case to the grid because then it would also be bonded to my panel.


The GC and the equipment guy all swear that I need to hit the motor for the water bond. I'm not buying it.

Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app
 

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Found something by burndy: pwb680

Didn't even know such an animal existed.

Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app
 

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Found something by burndy: pwb680

Didn't even know such an animal existed.

Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app
Pretty sure that's what I've installed in the past. Be sure to read the directions that come with it or you may be buying the guy a new skimmer!
 

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running dummy said:
That's what I'm asking. I didn't see anything provided to bond the water. Do you have a product number or an image for the plate? If you read my post all I'm asking is if it's wrong to bond the pump case to the grid because then it would also be bonded to my panel. The GC and the equipment guy all swear that I need to hit the motor for the water bond. I'm not buying it. Sent from my SAMSUNG-SM-G900A using electriciantalk.com mobile app
You need to hit the motor but that will not bond the water
 

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