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For separate derived systems I know that there has to be a main bonding jumper placed at the source or to the first disconnecting means. But I can not find anywhere in the code that says it can not be placed at both . As long as it is not past for first disconnect. Any insight on this? Dose this rule exist?
 

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You can bond at both.. as long as there are no conductive paths between the two.

Read 250.30 carefully.

Pete
 

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For separate derived systems I know that there has to be a main bonding jumper placed at the source or to the first disconnecting means. But I can not find anywhere in the code that says it can not be placed at both . As long as it is not past for first disconnect. Any insight on this? Dose this rule exist?
250.30(A)(1) System Bonding Jumper. An unspliced system bonding jumper shall comply with 250.28(A) through (D). This connection shall be made at any single point on the separately derived system from the source to the first system disconnecting means or overcurrent device
 
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